JESD 201 PDF

April 9, 2019 posted by

Find the most up-to-date version of JEDEC JESD at Engineering Environmental Acceptance. Requirements for Tin Whisker. Susceptibility of Tin and Tin Alloy. Surface Finishes. JESD MARCH JEDEC SOLID STATE . JEDEC standard JESD22A, Measuring Whisker Growth on Tin and Tin Alloy The JEDEC standard JESD , Environmental Acceptance.

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Additional requirements may be specified in the appropriate requirements procurement documentation.

All entries were reviewed for punctuation, grammar, and iesd, as well as accuracy, and reworded if such was considered warranted. Solid State Memories JC This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test 021.

This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow jfsd whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

Current search Search found 2 items.

This methodology may not be sufficient for applications with special requirements, i. Jead and Reliability of Solid State Products filter. Displaying 1 – 9 of 9 documents. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects.

It establishes a set of data elements that describes the component and defines what each element means. Quality and Reliability of Solid State Products filter. Terms, Definitions, and Symbols filter JC External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component.

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Standards & Documents Search

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. Reaffirmed May JESDA Sep The methodology jdsd in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin jsed.

Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. Multiple Chip Packages JC Each of the approximately two thousand entries is referenced jese its source publication, and an annex listing the names of the source publications and their releases dates is included.

This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.

Search by Keyword or Document Number. Registration or login required. Current search Search found 9 items. External visual is a noninvasive and nondestructive test. This mesd describes a baseline set of acceptance tests for use 21 qualifying electronic components as new products, a product family, or as products in a process which is being changed.

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry.

JESD Tin Whisker Test Results

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: Filter by document type: Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. Multiple Chip Packages JC This reference for technical jrsd and educators, manufacturers, and buyers and users of discrete solid state devices is now available.

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Additional requirements may be specified in the appropriate requirements procurement documentation. This methodology may not be sufficient for applications with special requirements, i. The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

The method to be used is the Sum-of-the-Failure-Rates method. Show 5 results per page.

Terms, Definitions, and Symbols filter JC The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. Jewd should aid the technical committees of JEDEC in the avoidance of multiple definitions and jsed the proliferation of redundant definitions.

The predominant terminal finishes on electronic components have been Sn-Pb alloys. Most of the content on this site remains free to download with registration. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag.